Chemical-Mechanical Planarization of Semiconductor Materials

This volume is a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, which is now a major part of state-of-the-art semiconductor technology. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

שנה

2004

שפה

English

סדרה

Springer Series in Materials Science -- 69

הוצאה

Springer Berlin Heidelberg

מהדורות

1

עמודים

428

ISBN

9783642077388

מקור הנתונים: Wikidata