Failure Modes and Mechanisms in Electronic Packages

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.

שנה

1998

שפה

English

הוצאה

Springer US

מהדורות

2

עמודים

370

ISBN

9781461377634

מקור הנתונים: Wikidata