Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.

שנה

2003

שפה

English

סדרה

The Springer International Series in Engineering and Computer Science -- 719

הוצאה

Springer US

מהדורות

1

עמודים

185

ISBN

9781461349891

מקור הנתונים: Wikidata