Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional CircuitsYue Ma

Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional Circuits

Name: Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional Circuits
ISBN: 9780367023430

Yue Ma, Christian Gontrand · 2019

איפה לקנות

המחיר באמזון משתנה מדי יום, אז הכי נכון לראות אותו שם ברגע הקנייה.

לצפייה באמזון

פרטי הספר

שנה: 2019
שפה: English
הוצאה: Taylor & Francis Group
מהדורות: 1
ISBN: 9780367023430

מקור הנתונים: Wikidata

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