The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

"This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build up of residual stress and warpage in the packages because of the TCE mismatch between the package materials as the package cools from its molding temperature to room temperature. The correct use of finite element tools for these problems is emphasised."--BOOK JACKET.

שנה

1999

שפה

English

הוצאה

Springer

מהדורות

1

עמודים

134

ISBN

9780792384854

מקור הנתונים: Wikidata