Thermal management of electronic systems

This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. For research and development engineers and scientists whose work involves the design and manufacture of electronic systems.

שנה

1994

שפה

English

הוצאה

Springer

מהדורות

1

עמודים

334

ISBN

9789401044721

מקור הנתונים: Wikidata