Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2C. Bailey

Advanced Manufacturing Process, Lead Free Interconnect Materials and Reliability Modeling for Electronics Packaging. Soldering and Surface Mount Technology, Volume 18, Issue 2

C. Bailey, J. Liu · 2006

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Book details

Year: 2006
Language: English
Publisher: Emerald Publishing Limited
Editions: 1
ISBN: 9781280547577

Data source: Wikidata

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