Advanced materials for thermal management of electronic packagingXingcun Colin Tong

Advanced materials for thermal management of electronic packaging

Xingcun Colin Tong · 2011

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Book details

Year: 2011
Language: English
Series: Springer series in advanced microelectronics -- 30
Publisher: Springer
Editions: 3
Pages: 616
ISBN: 9781441977588

Data source: Wikidata

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