Advances in Rapid Thermal and Integrated Processing
Fred Roozeboom · 1996
Where to buy
Amazon’s price changes daily, so the most accurate place to see it is there, at the moment you buy.
View on AmazonThis is an affiliate link: if you buy through it, the site earns a small commission at no extra cost to you, which helps us bring quality content and maintain the site. As an Amazon Associate we earn from qualifying purchases.
About the book
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Book details
- Year
- 1996
- Language
- English
- Series
- NATO ASI Series, Series E: Applied Sciences -- 318
- Publisher
- Springer Netherlands
- Editions
- 1
- Pages
- 566
- ISBN
- 9789048146963
Data source: Wikidata