Chiplet Design and Heterogeneous Integration PackagingJohn H. Lau
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau · 2023
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Book details
- Year
- 2023
- Language
- English
- Publisher
- Springer
- Editions
- 2
- Pages
- 547
- ISBN
- 9789811999161
Data source: Wikidata
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