Puligandla Viswanadham

Failure Modes and Mechanisms in Electronic Packages
Puligandla Viswanadham · 1998
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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies.
Book details
- Year
- 1998
- Language
- English
- Publisher
- Springer US
- Editions
- 2
- Pages
- 370
- ISBN
- 9781461377634
Data source: Wikidata