Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Erdogan Madenci · 2003
Where to buy
Amazon’s price changes daily, so the most accurate place to see it is there, at the moment you buy.
View on AmazonAbout the book
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Book details
- Year
- 2003
- Language
- English
- Series
- The Springer International Series in Engineering and Computer Science -- 719
- Publisher
- Springer US
- Editions
- 1
- Pages
- 185
- ISBN
- 9781461349891
Data source: Wikidata
More by Erdogan Madenci
