Manufacturing Challenges in Electronic Packaging
Y. C. Lee · 1998
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About the book
This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.
Book details
- Year
- 1998
- Language
- English
- Publisher
- Springer US
- Editions
- 1
- Pages
- 261
- ISBN
- 9781461376590
Data source: Wikidata
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