Microelectronics Packaging FundamentalsRao R. Tummala
Microelectronics Packaging Fundamentals
Rao R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein · 2001
Where to buy
Check today’s price on Amazon. We do not show prices because they change daily.
View on AmazonAffiliate link. As an Amazon Associate we earn from qualifying purchases.
Book details
- Year
- 2001
- Language
- English
- Publisher
- International Thomson Publishing Services Ltd
- Editions
- 1
- Pages
- 864
- ISBN
- 9780412149016
Data source: Wikidata
More by Rao R. Tummala
Microelectronics Packaging HandbookRao R. Tummala

Microelectronics Packaging Handbook
Rao R. Tummala · 1997
Wirebonding Microelect PackagingRao R. Tummala
Wirebonding Microelect Packaging
Rao R. Tummala · 2001
Heat Transfer Elect PackagesRao R. Tummala
Heat Transfer Elect Packages
Rao R. Tummala · 2001
Fundamentals of Microsystems PackagingRao R. Tummala
Fundamentals of Microsystems Packaging
Rao R. Tummala · 2001
Microelectronic Package Wiring Electronic DesignRao R. Tummala
Microelectronic Package Wiring Electronic Design
Rao R. Tummala · 2001
Plastic Thin Film Ceramic PackageRao R. Tummala
Plastic Thin Film Ceramic Package
Rao R. Tummala · 2001
Microelectronics Packaging HandbookRao R. Tummala
Microelectronics Packaging Handbook
Rao R. Tummala · 1996