Modeling and simulation for microelectronic packaging assemblyS. Liu
Modeling and simulation for microelectronic packaging assembly
S. Liu · 2011
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About the book
"This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"--
Book details
- Year
- 2011
- Language
- English
- Publisher
- Wiley
- Editions
- 1
- ISBN
- 9780470827802
Data source: Wikidata
