Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip ModuleK. Otsuka

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

K. Otsuka · 1899

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Book details

Year: 1899
Language: English
Publisher: Springer
Editions: 1
Pages: 256
ISBN: 9781851665792

Data source: Wikidata

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