Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects EntanglementYue Ma

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Yue Ma, Christian Gontrand · 2019

Where to buy

Amazon’s price changes daily, so the most accurate place to see it is there, at the moment you buy.

Book details

Year: 2019
Language: English
Publisher: Taylor & Francis Group
Editions: 4
Pages: 226
ISBN: 9780429399619

Data source: Wikidata

More by Yue Ma

Dynamics and Advanced Motion Control of Unmanned Ground off-Road VehicleYue Ma

Dynamics and Advanced Motion Control of Unmanned Ground off-Road Vehicle

Dynamics and Advanced Motion Control of off-Road UGVsYue Ma

Dynamics and Advanced Motion Control of off-Road UGVs

Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional CircuitsYue Ma

Substrate Interconnects Noise Immunity and Electro-Thermal Analysis in Bulk Silicon Technology for Three-dimensional Circuits

Leng si kaoYue Ma

Xiao yuan ling yi shi jian bu =Yue Ma

Xiao yuan ling yi shi jian bu =

Xi'an Legacies of Ancient Chinese CivilizationYue Ma

Xi'an Legacies of Ancient Chinese Civilization

Ningxia =Yue Ma