booktheque

Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

Jie Cheng · 2019

Where to buy

Amazon’s price changes daily, so the most accurate place to see it is there, at the moment you buy.

View on Amazon

Book details

Year
2019
Publisher
Springer
Editions
2
Pages
155
ISBN
9789811355851

Data source: Wikidata

More by Jie Cheng