Wafer Bonding
Marin Alexe · 2004
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About the book
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Book details
- Year
- 2004
- Language
- English
- Series
- Springer Series in MATERIALS SCIENCE -- 75
- Publisher
- Springer Berlin Heidelberg
- Editions
- 1
- Pages
- 504
- ISBN
- 9783642059155
Data source: Wikidata
