Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out TechnologyJohn H. Lau

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

John H. Lau · 2024

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Book details

Year: 2024
Language: English
Publisher: Springer
Editions: 1
ISBN: 9789819721399

Data source: Wikidata

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