Materials, Technology and Reliability for Advanced Interconnects and Low-K DielectricsG. S. Oehrlein
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics
G. S. Oehrlein, K. Maex, S. Ogawa, J. T. Wetzel · 2014
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Book details
- Year
- 2014
- Language
- English
- Publisher
- University of Cambridge ESOL Examinations
- Editions
- 1
- Pages
- 614
- ISBN
- 9781107413153
Data source: Wikidata