Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out TechnologyJohn H. Lau

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

John H. Lau · 2024

איפה לקנות

המחיר באמזון משתנה מדי יום, אז הכי נכון לראות אותו שם ברגע הקנייה.

לצפייה באמזון

פרטי הספר

שנה: 2024
שפה: English
הוצאה: Springer
מהדורות: 1
ISBN: 9789819721399

מקור הנתונים: Wikidata

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