John H. Lau
John H. Lau
17 ספרים במאגר
ספרים
Chip scale package (CSP)John H. Lau
Chip scale package (CSP)
John H. Lau · 1999
Chiplet Design and Heterogeneous Integration PackagingJohn H. Lau
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau · 2023
Semiconductor Advanced PackagingJohn H. Lau
Semiconductor Advanced Packaging
John H. Lau · 2022
Assembly and Reliability of Lead-Free Solder JointsJohn H. Lau
Assembly and Reliability of Lead-Free Solder Joints
John H. Lau · 2021
Heterogeneous IntegrationsJohn H. Lau
Heterogeneous Integrations
John H. Lau · 2019
Solder joint reliabilityJohn H. Lau
Solder joint reliability
John H. Lau · 2013
Advanced MEMS packagingJohn H. Lau
Advanced MEMS packaging
John H. Lau · 2010
Electronics manufacturingJohn H. Lau
Electronics manufacturing
John H. Lau · 2002
MicroviasJohn H. Lau
Microvias
John H. Lau · 2001
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesJohn H. Lau
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
John H. Lau · 2000
Electronic packagingJohn H. Lau
Electronic packaging
John H. Lau · 1998
Chip On BoardJohn H. Lau
Chip On Board
John H. Lau · 1994
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)John H. Lau
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)
John H. Lau · 1993
Solder Joint ReliabilityJohn H. Lau
Solder Joint Reliability
John H. Lau · 1991
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out TechnologyJohn H. Lau
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau · 2024
Fan-Out Wafer-Level PackagingJohn H. Lau
Fan-Out Wafer-Level Packaging
John H. Lau · 2018
Reliability Of Rohscompliant 2d And 3d Ic InterconnectsJohn H. Lau
Reliability Of Rohscompliant 2d And 3d Ic Interconnects
John H. Lau · 2010