John H. Lau

Reliability Of Rohscompliant 2d And 3d Ic Interconnects
John H. Lau · 2010
פרטי הספר
- שנה
- 2010
- הוצאה
- McGraw-Hill Professional Publishing
- מהדורות
- 1
- עמודים
- 640
- ISBN
- 9780071753791
מקור הנתונים: Wikidata
עוד של John H. Lau
John H. Lau

Chip scale package (CSP)
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John H. Lau

Chiplet Design and Heterogeneous Integration Packaging
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Semiconductor Advanced Packaging
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Assembly and Reliability of Lead-Free Solder Joints
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Heterogeneous Integrations
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Solder joint reliability
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Advanced MEMS packaging
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Electronics manufacturing
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Microvias
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Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
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